We are looking for a Component Architect to join the Microelectronics Division at IAI’s ELTA. This role involves advanced RFIC and SiP package design for cutting-edge defense systems.

The position includes

• Development of integrated SiP (System-in-Package) modules
• Component definition based on RF layout technologies and integrated circuits (RFICs), using Cadence tools
• Use of design and simulation tools for hardware layout and component engineering
• Advanced IC package design using GaN, GaAs, and Si technologies

What we’re looking for

• B.Sc. in Electrical and Electronics Engineering (preference for university graduates)
• Deep knowledge in RFIC layout and design, including use of simulation and layout tools – required
• Hands-on experience with Cadence tools – required
• Proven experience in advanced IC packaging with GaN, GaAs, or Si technologies – required
• At least 3 years of experience in hardware development – required
• Strong command of English (speaking, reading, and writing)
• Ability to work independently and learn quickly

Good to know

The Microelectronics Division at ELTA is responsible for the development and manufacturing of electronic hardware, microwave modules, and mechanical components for all of ELTA’s systems. This role offers an opportunity to work at the core of ELTA’s innovation, developing next-generation components in a highly advanced technological environment.